Lv2
144 积分 2025-09-11 加入
Direct light-to-token conversion with integrated 2D photosensitive memory
27天前
已完结
The Influence of the Process Conditions and Structure of Organic Additives on the Formation and Properties of Coatings in Electrochemical Nickel Plating
1个月前
已完结
EOT Scaling Via 300mm MX2 Dry Transfer - Steps Toward a Manufacturable Process Development and Device Integration
1个月前
已完结
First EUV-Enabled Integration Route for 50 nm Pitch N and PMOS Transistors with 2D Materials Channel from a 300 mm Fab
1个月前
已完结
The Road for 2D Semiconductors in the Silicon Age
1个月前
已完结
The future of two-dimensional semiconductors beyond Moore’s law
1个月前
已完结
Monolithic three-dimensional tier-by-tier integration via van der Waals lamination
1个月前
已完结
Breaking the limitation of van der Waals integration
1个月前
已完结
Van der Waals device integration beyond the limits of van der Waals forces using adhesive matrix transfer
1个月前
已完结
Near-Memory LLM Inference Processor based on 3D DRAM-to-logic Hybrid Bonding
6个月前
已完结
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