Lv2
178 积分 2020-04-27 加入
Ultra-low energy radical treatments for advanced 3D device structures
18天前
已关闭
Pulsed laser induced atomic layer etching of silicon
2个月前
已关闭
In Situ Monitoring of Etching Characteristic and Surface Reactions in Atomic Layer Etching of SiN Using Cyclic CF4/H2 and H2 Plasmas
2个月前
已完结
Dry Etching Technology for Semiconductors
4个月前
已完结
Selective Etching of SiO2 by Radical Recombination through NF3/H2 Pulsed RF Plasma
6个月前
已完结
Effect of different pulse modes during Cl2/Ar inductively coupled plasma etching on the characteristics of nanoscale silicon trench formation
6个月前
已完结
Titanium Nitride Hard Mask Removal with Selectivity to Tungsten in FEOL
7个月前
已完结
Selectivity between SiO2 and SiNx during Thermal Atomic Layer Etching Using Al(CH3)3/HF and Spontaneous Etching Using HF and Effect of HF + NH3 Codosing
8个月前
已完结
皖公网安备34019202002308
