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158 积分 2023-03-25 加入
Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging
5天前
已完结
Surfactant-stabilized copper paticles for low-temperature sintering: Paste preparation using a milling with small zirconia beads: Effect of pre-treatment with the disperse medium
17天前
已完结
Development of the Third-generation Semiconductor Interconnect Materials and Progress of Low-temperature Sintering of Copper Nanoparticles
17天前
已完结
Research Progress on Sintered Micro-silver Paste for Power Electronic Packaging
17天前
已完结
Influence of sintering environment on silver sintered on copper substrate
17天前
已完结
Microstructure evolution and micromechanical behavior of solvent-modified Cu–Ag composite sintered joints for power electronics packaging at high temperatures
2个月前
已完结
Advancements in copper and silver sintering as interconnect materials in electronics applications: review
3个月前
已完结
Molten salt synthesis of MnO2/Mn2O3 composite as a high-performance cathode material for rechargeable button zinc‑manganese ultra-high temperature battery
4个月前
已完结
Analysis of no-clean flux spatter during the soldering process
10个月前
已完结
Solderability and reliability evolution of no clean solder fluxes for selective soldering
10个月前
已完结
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