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60 积分 2026-06-02 加入
Thermal-Mechanical Modeling of Package Reflow for Cooling of Future CPU and GPU Devices
18小时前
待确认
Thermal, wetting, and microstructural properties of the tin–bismuth (Sn–58Bi) solder joint at different reflow temperatures
1个月前
已完结
Statistical-based simulation and reflow profile optimization for improving self-alignment performance − an experimental study
1个月前
已完结
Thin-film metallization and micro-assembly driven comparative failure modes in advanced ceramic packaging under thermal cycling
1个月前
已完结
Direct Measurement of the Electrocaloric Temperature Change in Multilayer Ceramic Components using Resistance‐Welded Thermocouple Wires
1个月前
已完结
Joule heating enables ultra-fast SiC ceramics joining in seconds
1个月前
已完结
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