| 标题 |
Thermal, wetting, and microstructural properties of the tin–bismuth (Sn–58Bi) solder joint at different reflow temperatures |
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| DOI | |
| 其它 |
期刊:Journal of Materials Science: Materials in Electronics 作者:Huzaifa Azam; Amares Singh; Wei Hong Tan; Muhammad Amir Aziat Ishak; Bahman Nasiri-Tabrizi; et al 出版日期:2026-09-01 |
| 求助人 | |
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(2025-6-4)