Lv4
470 积分 2022-03-31 加入
铜微互连线原子迁移仿真研究
1年前
已完结
Structure-dependent behavior of stress-induced voiding in Cu interconnects
1年前
已完结
Recent Progress in the Analysis of Electromigration and Stress Migration in Large Multisegment Interconnects
1年前
已完结
Study of stress migration and electromigration interaction in copper/low-κ interconnects
1年前
已完结
Stress migration in a copper - Aluminum hybrid technology
1年前
已完结
The Critical Role of Dielectric Trench Etch in Enhancing Cu/low-k Dielectric Reliability for Advanced CMOS Technologies
1年前
已完结
Numerical and Experimental Analysis of Cu Diffusion in Plasma-Treated Tungsten Barrier
1年前
已完结
Stress migration risk on electromigration reliability in advanced narrow line copper interconnects
1年前
已完结
Degradation behaviors of micro ball grid array (μBGA) solder joints under the coupled effects of electromigration and thermal stress
1年前
已完结
The effect of stress migration on electromigration in dual damascene copper interconnects
1年前
已完结
皖公网安备34019202002308
