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18 积分 2025-11-01 加入
Toward Advanced High‐k and Electrode Thin Films for DRAM Capacitors via Atomic Layer Deposition
4天前
已完结
Reliability Characteristics of a High Density Metal- Insulator-Metal Capacitor on Intel’s 10+ Process
21天前
已完结
Integration of Si-Interposer and High Density MIM Capacitor on 2.5D Foveros Face-to-Face Architecture
21天前
已完结
Structural Integrity of 3-D Metal–Insulator–Metal Capacitor Embedded in Fully Filled Cu Through-Silicon via
22天前
已完结
Modeling and Characterization of thin Al2O3–HfO2 stacked Metal-Insulator-Metal and Deep Trench Decoupling Capacitors for Advanced Packaging Applications
22天前
已完结
The role of the HfO2–TiN interface in capacitance–voltage nonlinearity of Metal-Insulator-Metal capacitors
1个月前
已完结
The fundamentals and applications of ferroelectric HfO2
1个月前
已完结
Preparation and characterization of non-reactive sputtered ultrathin TiN electrodes for HfO2-based ferroelectric capacitors
1个月前
已完结
Physical properties and electrical characteristics of H2O-based and O3-based HfO2 films deposited by ALD
1个月前
已完结
Toward Advanced High‐k and Electrode Thin Films for DRAM Capacitors via Atomic Layer Deposition
2个月前
已完结
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