Lv4
510 积分 2026-01-29 加入
Identification of subsurface damage of 4H-SiC wafers by combining photo-chemical etching and molten-alkali etching
6小时前
已完结
Grinding of silicon wafers: A review from historical perspectives
1个月前
已完结
Residual Stress Measurement of Silicon Nitride and Silicon Carbide by X-Ray Diffraction Using Gaussian Curve Method
2个月前
已关闭
X-ray diffraction under grazing incidence conditions
2个月前
已完结
Origins and characterization techniques of stress in SiC crystals: A review
2个月前
已完结
Residual Stress Measurements of 4H-SiC Crystals Using X-Ray Diffraction
2个月前
已完结
Residual stress distribution of silicon wafers machined by rotational grinding based on molecular dynamics
2个月前
已完结
Decoupling of Nanoindentation Residual Stress Field in Single-crystalline 4H-SiC via Micro-Raman Spectroscopy
2个月前
已完结
Exploring stress and deformation in filament-wound composite pressure vessel liners using PyMAPDL
2个月前
已完结
Prediction of Welding Deformations of CRH380 Aluminum Alloy Side-Wall with Equivalent Thermal Load Method Based on Inherent Strain
3个月前
已完结
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