Lv4
520 积分 2026-01-29 加入
Uniformity Prediction in Silicon Wafer Double-Sided Polishing: A Pad Topography-Dependent Material Removal Model with Pressure–Trajectory Coupling
8天前
已完结
Predictive modeling of deformation induced by residual stress for thin-walled parts in double-sided alternating precision turning
29天前
已完结
Identification of subsurface damage of 4H-SiC wafers by combining photo-chemical etching and molten-alkali etching
1个月前
已完结
Grinding of silicon wafers: A review from historical perspectives
2个月前
已完结
Residual Stress Measurement of Silicon Nitride and Silicon Carbide by X-Ray Diffraction Using Gaussian Curve Method
3个月前
已关闭
X-ray diffraction under grazing incidence conditions
4个月前
已完结
Origins and characterization techniques of stress in SiC crystals: A review
4个月前
已完结
Residual Stress Measurements of 4H-SiC Crystals Using X-Ray Diffraction
4个月前
已完结
Residual stress distribution of silicon wafers machined by rotational grinding based on molecular dynamics
4个月前
已完结
Decoupling of Nanoindentation Residual Stress Field in Single-crystalline 4H-SiC via Micro-Raman Spectroscopy
4个月前
已完结
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