Lv11
88 积分 2026-07-02 加入
A Study on the Advanced Chip to Wafer Stack for Better Thermal Dissipation of High Bandwidth Memory
1个月前
已完结
One-dimensional Cu–Ni core–shell composites as liquid epoxy molding compound fillers for enhanced heat dissipation and electromagnetic interference shielding in high-bandwidth memory
1个月前
已完结
A monolithic fabrication platform for intrinsically stretchable polymer transistors and complementary circuits
1个月前
已完结
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