Lv2
170 积分 2025-01-02 加入
Laser machining of silicon carbide: current status, applications and challenges
20天前
已完结
Material removal prediction and abrasive swarm performance in electrorheological polishing of zirconium-based amorphous alloy with multi-layer electrodes
4个月前
已完结
Improved Electrorheological Polishing Property of Poly(Ionic Liquid)/Al2O3 Composite Particles Prepared via Pickering Emulsion Polymerization
5个月前
已完结
Material removal mechanism in and experiments of electrorheological polishing of foldable intraocular lenses at low temperatures
5个月前
已完结
A Study on Improving Polishing Process Effectiveness for Silicon Reclaim Wafer
5个月前
已完结
大尺寸硅片表面抛光材料去除非均匀性研究
5个月前
已完结
A study on surface grinding of 300 mm silicon wafers
6个月前
已关闭
A novel method for simultaneous measurement of thickness, refractive index, bow, and warp of a large silicon wafer using a spectral-domain interferometer
6个月前
已完结
皖公网安备34019202002308
