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510 积分 2025-07-28 加入
Microstructure and mechanical properties of the In–48Sn–xAg low-temperature alloy
14天前
已完结
High-performance full IMC/Cu foam composite joints prepared by transient liquid phase soldering for high temperature application
16天前
已完结
Ostwald Ripening — A Survey
1个月前
已完结
Tuning the growth of intermetallic compounds at Sn-0.7Cu solder/Cu substrate interface by adding small amounts of indium
1个月前
已完结
Strengthening Materials by Engineering Coherent Internal Boundaries at the Nanoscale
1个月前
已完结
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