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440 积分 2025-07-28 加入
Ostwald Ripening — A Survey
24天前
已完结
Tuning the growth of intermetallic compounds at Sn-0.7Cu solder/Cu substrate interface by adding small amounts of indium
28天前
已完结
Strengthening Materials by Engineering Coherent Internal Boundaries at the Nanoscale
1个月前
已完结
Transformation of dislocation strengthening mechanisms induced by graphene nanoplates and ZrB2 nanoparticle in nanolaminated Al matrix composites
1个月前
已关闭
Integration of machine learning with phase field method to model the electromigration induced Cu6Sn5 IMC growth at anode side Cu/Sn interface
2个月前
已关闭
Dynamical IMC-growth calculation
2个月前
已关闭
Microstructure and mechanical properties of the In-48Sn-xAg low-temperature alloy
3个月前
已关闭
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