Lv32
260 积分 2025-07-28 加入
Two-stage nonequilibrium eutectic transformation in a Sn–3.5Ag–3In solder
3小时前
求助中
Lead-Free Solder
4小时前
求助中
Evolutions of the interface and shear strength between SnAgCu–xNi solder and Cu substrate during isothermal aging at 150°C
17小时前
已完结
Isothermal aging and shear creep behavior of a novel lead-free solder joint with small additions of Bi, Sb and Ni
17小时前
求助中
Evolutions of the interface and shear strength between SnAgCu–xNi solder and Cu substrate during isothermal aging at 150°C
1天前
已完结
Influence of thermal ageing on void content and shear strength for selected lead free solder die-attach
1天前
已关闭
Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces
1个月前
已关闭
Interfacial reactions between molten Sn−Bi−X solders and Cu substrates for liquid solder interconnects
1个月前
已关闭
Potential application of ceramic matrix composites to aero-engine components
1个月前
已完结
Identification and evolution of intermetallic compounds formed at the interface between In-48Sn and Cu during liquid soldering reactions
1个月前
已完结
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