Lv11
20 积分 2025-04-01 加入
Thermal properties of Sn-based solder alloys
43分钟前
已完结
Thermal Conductivity Variation with Temperature for Lead-Free Ternary Eutectic Solders
44分钟前
已完结
Thermophysical Properties of Sn–Ag–Cu Based Pb-Free Solders
56分钟前
已完结
Influence of External Interface Normal Stress on the Growth of Cu–Sn IMC During Aging
13天前
已完结
Diffusion Parameters and Growth Mechanism of Phases in the Cu-Sn System
13天前
已完结
Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing
13天前
已完结
The effect of atomic concentration on the Cu-Sn IMC formation via molecular dynamic simulation
5个月前
已完结
Molecular dynamics simulation of the interfacial evolution and whisker growth of copper-tin coating under electrothermal coupling
5个月前
已完结
High-quality laser slicing of single-crystal semiconductors guided by energy-dependent phase transition and crack propagation: A 4H-SiC case study
6个月前
已完结
On the initial stages and growth process of intermetallic compounds at Cu/Sn interface: A MD simulation and experimental study
6个月前
已完结
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