Lv52
1026 积分 2026-05-09 加入
Crack growth rate and crack path in adhesively bonded joints: Comparison of creep, fatigue and fracture
5分钟前
待确认
Crack deflection at an interface between dissimilar elastic materials
13分钟前
已完结
Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms
9天前
已完结
Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications
9天前
已完结
Investigation of moisture-induced crack propagation in the soft-termination multi-layer ceramic capacitor during thermal reflow process
9天前
已完结
Isothermal aging effects on flex cracking of multilayer ceramic capacitors with standard and flexible terminations
9天前
已完结
Deformation and crack growth in multilayered ceramic capacitor during thermal reflow process: numerical and experimental investigation
20天前
已完结
A hybrid modeling framework for predicting the multilayer ceramic capacitor reliability under thermal-electrical coupling operating conditions
2个月前
已完结
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