| 标题 |
Investigation of moisture-induced crack propagation in the soft-termination multi-layer ceramic capacitor during thermal reflow process |
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| DOI | |
| 其它 |
期刊:Soldering & Surface Mount Technology 作者:Zuraihana Bachok; Aizat Abas; Hehgeraj A/L Raja Gobal; Norwahida Yusoff; Mohamad Riduwan Ramli; et al 出版日期:2023-08-02 |
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(2025-6-4)