Lv4
540 积分 2021-01-20 加入
PLAD (Plasma Doping) for p-type Deep Trench Doping in Power Device Applications
8天前
已完结
Recent Advances in Plasma Etching for Micro and Nano Fabrications of Silicon-based Materials: A Review
1个月前
已完结
Nanoscale self-assembly: concepts, applications and challenges
6个月前
已完结
Study of Inner Spacer Module Process for Gate All Around Field Effect Transsistors
6个月前
已完结
A Two‐Step Dry Etching Model for Non‐Uniform Etching Profile in Gate‐All‐Around Field‐Effect Transistor Manufacturing
6个月前
已完结
Oxide and 2D TMD Semiconductors for 3D DRAM Cell Transistors
6个月前
已完结
New bending mode in SAQP Si fins and its mitigation
11个月前
已完结
The study of STI etching micro-loading in reactive ion etch (RIE)
1年前
已完结
Ferroelectric Field Effect Transistors (FeFETs): Advancements, challenges and exciting prospects for next generation Non-Volatile Memory (NVM) applications
1年前
已完结
Asynchronously Pulsed Plasma for High Aspect Ratio Nanoscale Si Trench Etch Process
1年前
已完结
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