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678 积分 2024-01-09 加入
Low-temperature direct and indirect bonding using plasma activation for 3D integration
11小时前
待确认
High-Efficiency and Low-Temperature Direct Bonding of SiC to Si via Atmospheric Inductively Coupled Plasma Activation
11小时前
待确认
Investigation on the high temperature stability and potential barrier of Si/Al2O3/Si bonded by surface activated bonding technology
25天前
已完结
Quantification of Interfacial Voids Using Positron Annihilation Spectroscopy for Mechanism Study on SiCN Bonding and SiN Bonding
25天前
已完结
Quantification of wafer bond strength under controlled atmospheres
25天前
已完结
Recent progress in surface activated bonding for 3D and heterogeneous integration
26天前
已完结
Quantification of Interfacial Voids Using Positron Annihilation Spectroscopy for Mechanism Study on SiCN Bonding and SiN Bonding
26天前
已完结
SAB-Enabled Room Temperature Hybrid Bonding
26天前
已完结
Surface modification of nanotwinned copper and SiCN using N2 and Ar plasma activation
26天前
已完结
Mechanisms of room-temperature SiCN pre-bonding and low-temperature post-annealing of SiCN/nanocrystalline-nanotwinned Cu hybrid joints
26天前
已完结
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