Lv4
668 积分 2024-01-09 加入
Electrical Transport at n-Ga2O3/n-SiC Hetero-Interface Constructed by Hydrophilic and Surface Activated Bonding
1个月前
已完结
Low-temperature direct and indirect bonding using plasma activation for 3D integration
1个月前
已完结
High-Efficiency and Low-Temperature Direct Bonding of SiC to Si via Atmospheric Inductively Coupled Plasma Activation
1个月前
已完结
Investigation on the high temperature stability and potential barrier of Si/Al2O3/Si bonded by surface activated bonding technology
2个月前
已完结
Quantification of Interfacial Voids Using Positron Annihilation Spectroscopy for Mechanism Study on SiCN Bonding and SiN Bonding
2个月前
已完结
Quantification of wafer bond strength under controlled atmospheres
2个月前
已完结
Recent progress in surface activated bonding for 3D and heterogeneous integration
2个月前
已完结
Quantification of Interfacial Voids Using Positron Annihilation Spectroscopy for Mechanism Study on SiCN Bonding and SiN Bonding
2个月前
已完结
SAB-Enabled Room Temperature Hybrid Bonding
2个月前
已完结
Surface modification of nanotwinned copper and SiCN using N2 and Ar plasma activation
2个月前
已完结
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