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30 积分 2024-01-09 加入
Room Temperature Wafer Bonding of Glass Using Aluminum Oxide Intermediate Layer
4小时前
待确认
Surface Activated Bonding of Glass Using Aluminum Oxide Intermediate Layer for Microchannel Fabrication
4小时前
求助中
Surface activated bonding of GaAs and SiC wafers at room temperature for improved heat dissipation in high-power semiconductor lasers
5个月前
已完结
Direct Wafer Bonding of SiC-SiC by SAB for Monolithic Integration of SiC MEMS and Electronics
9个月前
已完结
Effect of Growth Conditions on the Surface Morphology and Defect Density of CS‐PVT‐Grown 3C‐SiC
10个月前
已完结
Rapid Growth of SiC single crystals using CVD-SiC block sources via sublimation method
10个月前
已完结
Role of the Growth Facet on the Generation and Expansion of Stacking Faults in PVT-Grown n-Type 4H-SiC Single-Crystal Boules
1年前
已完结
Step unbunching phenomenon on 4H-SiC (0001) surface during hydrogen etching
1年前
已完结
Nucleation of Threading Dislocations in 4H-SiC at Early Physical-Vapor-Transport Growth Stage
1年前
已完结
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