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518 积分 2024-01-09 加入
Plasma-activated wafer bonding: the new low-temperature tool for MEMS fabrication
1个月前
已完结
Surface Activated Cu/SiO2 Hybrid Bonding for Room Temperature 3D Integration
1个月前
已完结
III–V-on-silicon solar cells reaching 33% photoconversion efficiency in two-terminal configuration
1个月前
已完结
Si-Ge Heterostructures Fabricated by Room Temperature Wafer Bonding
1个月前
已完结
Surface Activated Si-Si Wafer Bonding Using Different Ion Species
1个月前
已完结
Atomic structure of Al/Al interface formed by surface activated bonding
2个月前
已完结
Cu-Cu Room Temperature Bonding - Current Status of Surface Activated Bonding(SAB) -
2个月前
已完结
Surface activated bonding of silicon wafers at room temperature
2个月前
已完结
Cleaning effect on surface activated aluminum to aluminum wafer bonding
2个月前
已关闭
Optimization of a BEOL Aluminum Deposition Process Enabling Wafer Level Al-Al Thermo-Compression Bonding
2个月前
已完结
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