Lv4
568 积分 2024-01-09 加入
Atomic structure of Al/Al interface formed by surface activated bonding
19天前
已完结
Cu-Cu Room Temperature Bonding - Current Status of Surface Activated Bonding(SAB) -
19天前
已完结
Surface activated bonding of silicon wafers at room temperature
20天前
已完结
Cleaning effect on surface activated aluminum to aluminum wafer bonding
20天前
已关闭
Optimization of a BEOL Aluminum Deposition Process Enabling Wafer Level Al-Al Thermo-Compression Bonding
20天前
已完结
(Invited) Al-Al Waferbonding Process Development for Heterogeneous Integration
20天前
已完结
Environmental Stress Testing of Wafer-Level Al-Al Thermocompression Bonds: Strength and Hermeticity
25天前
已完结
Interfacial characterization of Al-Al thermocompression bonds
25天前
已完结
A Collective Die to Wafer Bonding Approach Based on Surface-Activated Aluminum–Aluminum Thermocompression Bonding
25天前
已完结
Al-Al wafer-level thermocompression bonding applied for MEMS
25天前
已完结
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