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1790 积分 2023-11-08 加入
Photosensitive Polyimides as Enabling Materials for Advanced Semiconductor Packaging
5天前
已完结
Preparation and characterization of low dielectric cross-linked polyimide containing fluorene group via post-polymerization cross-linking
3个月前
已完结
Fluorine-free triptycene-based poly(ester imide) films: Role of mesogen units in balancing free volume and structural order for low Dk and low Df
3个月前
已完结
Intrinsic ultralow Dk/Df polyimides with hydrophobicity and high adhesion based on a molecular threading and interlocking mechanism
3个月前
已完结
One day of food restriction does not result in an increase in subsequent daily food intake in humans
4个月前
已完结
Recent progress and challenges of photosensitive polyimides in advanced packaging: Technology beyond limit
5个月前
已完结
Electrospun biomass polyethylene furanoate nonwoven substrates for flexible thermoelectric generators
5个月前
已完结
Sustainable Poly(butylene furanoate)/Carbon Nanotube Composite Fibers for Wearable Thermoelectric Generator
5个月前
已完结
Micro-LED Data Interconnect for Scale-Up Networks with Record Energy Efficiency
7个月前
已完结
CoWoS Architecture Evolution for Next Generation HPC on 2.5D System in Package
7个月前
已完结
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