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808 积分 2026-02-15 加入
Reaction Mechanisms in Copper Atomic Layer Deposition Using Copper(II) Hexafluoroacetylacetonate and Diethylzinc via In Situ Time-of-Flight Mass Spectrometry
14天前
已完结
Advancements in Ultra-High Aspect Ratio Via Interconnection Technology Enabled by Atomic Layer Deposition
14天前
已完结
Process Integration and Reliability Challenges of Through-Glass Vias for Glass-Based Advanced Packaging: A Focused Review
14天前
已完结
Recent advances in CMOS-compatible synthesis and integration of 2D materials
3个月前
已完结
Low-thermal-budget synthesis of monolayer molybdenum disulfide for silicon back-end-of-line integration on a 200 mm platform
3个月前
已完结
Growth-based monolithic 3D integration of single-crystal 2D semiconductors
3个月前
已完结
Toolbox of Advanced Atomic Layer Deposition Processes for Tailoring Large-Area MoS2 Thin Films at 150 °C
3个月前
已完结
Wafer-Scale Demonstration of BEOL-Compatible Ambipolar MoS2 Devices Enabled by Plasma-Enhanced Atomic Layer Deposition
3个月前
已完结
Recent progress on kinetic control of chemical vapor deposition growth of high-quality wafer-scale transition metal dichalcogenides
3个月前
已完结
Atomic Layer Deposition of Transition-Metal Dichalcogenides
3个月前
已完结
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