Lv5
988 积分 2026-02-15 加入
Die-to-Die Bonding Development Employing Atomic Layer Deposition to Enable Heterogeneous Integration of Optoelectronic Integrated Circuits
21天前
已完结
NEW METHOD FOR PREDICTION OF BINARY GAS-PHASE DIFFUSION COEFFICIENTS
1个月前
已完结
Comparison of saturator designs for delivery of low-volatility liquid precursors
1个月前
已完结
Comprehensive analysis of determining factors of the effective work function of TiAlC/TiN metal gates for advanced gate-all-around CMOS integration
1个月前
已完结
Reaction Mechanisms in Copper Atomic Layer Deposition Using Copper(II) Hexafluoroacetylacetonate and Diethylzinc via In Situ Time-of-Flight Mass Spectrometry
1个月前
已完结
Advancements in Ultra-High Aspect Ratio Via Interconnection Technology Enabled by Atomic Layer Deposition
1个月前
已完结
Process Integration and Reliability Challenges of Through-Glass Vias for Glass-Based Advanced Packaging: A Focused Review
1个月前
已完结
Recent advances in CMOS-compatible synthesis and integration of 2D materials
4个月前
已完结
Low-thermal-budget synthesis of monolayer molybdenum disulfide for silicon back-end-of-line integration on a 200 mm platform
4个月前
已完结
Growth-based monolithic 3D integration of single-crystal 2D semiconductors
4个月前
已完结
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