Lv12
30 积分 2025-12-22 加入
Cu–Cu direct bonding in air by in-situ reduction of copper oxide with glycerol
14小时前
已完结
In-situ measurement of thermal expansion in Cu/SiO2 hybrid structures using atomic force microscopy at elevated temperatures
14小时前
待确认
Enhanced thermal expansion with nanocrystalline Cu in SiO2 vias for hybrid bonding
15小时前
已完结
Efficient Cu/SiO2 hybrid bonding through alkaline surface modification for 3D IC integration
15小时前
已完结
Low-temperature Cu/SiO2 hybrid bonding based on Ar/H2 plasma and citric acid cooperative activation for multi-functional chip integration
15小时前
已完结
Low temperature Cu/SiO2 hybrid bonding via 〈1 1 1〉-oriented nanotwinned Cu with Ar plasma surface modification
20小时前
已完结
Correlation between Pre-Bonding Surface and Bond Wave Speed
10个月前
已完结
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