Lv11
68 积分 2022-09-06 加入
Characterization of Gap Fill Materials for Planarizing Substrate in Via-First Dual Damascene Lithography Process
1小时前
求助中
Characterization of Gap Fill Materials for Planarizing Substrate in Via-First Dual Damascene Lithography Process
2小时前
已完结
Robust Cu Dual Damascene Interconnects With Porous SiOCH Films Fabricated by Low-Damage Multi-Hard-Mask Etching Technology
26天前
已关闭
In situ post etching treatment as a solution to improve defect density for porous low-k integration using metallic hard masks
1个月前
已完结
Mechanistic study of plasma damage of low k dielectric surfaces
1个月前
已完结
The future of ferroelectric field-effect transistor technology
2个月前
已完结
Polyimide foams derived from a high Tg polyimide with grafted poly(α-methylstyrene)
4个月前
已完结
Damage free integration of ultralow-k dielectrics by template replacement approach
6个月前
已完结
Reliability degradation impact by ultra low-k dielectrics and improvement study for BEOL process beyond 28nm technology
8个月前
已完结
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