Lv2
146 积分 2022-09-06 加入
The future of ferroelectric field-effect transistor technology
1个月前
已完结
Polyimide foams derived from a high Tg polyimide with grafted poly(α-methylstyrene)
2个月前
已完结
Damage free integration of ultralow-k dielectrics by template replacement approach
5个月前
已完结
Reliability degradation impact by ultra low-k dielectrics and improvement study for BEOL process beyond 28nm technology
6个月前
已完结
A novel approach to dual damascene patterning
8个月前
已完结
Plasma processing of low-k dielectrics
9个月前
已完结
Plasma processing of low-k dielectrics
9个月前
已完结
Plasma damage mechanisms for low-k porous SiOCH films due to radiation, radicals, and ions in the plasma etching process
9个月前
已完结
Silicon Damage Mechanism In Oxide Etch
9个月前
已完结
Plasma damage evaluation of an integrated in-situ directional resist stripping process in magnetically enhanced RIE etcher for dual damascene application
9个月前
已完结
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