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Reactive Sputtering of SiCN Films: Process Optimization and Bonding Behavior for Cu Hybrid Bonding
1天前
待确认
Influence of Composition of SiCN Film for Surface Activated Bonding
1天前
已完结
Mechanisms of room-temperature SiCN pre-bonding and low-temperature post-annealing of SiCN/nanocrystalline-nanotwinned Cu hybrid joints
1天前
已完结