Lv4
554 积分 2022-05-26 加入
Plasma Science and Technology - Basic Fundamentals and Modern Applications
2个月前
已关闭
Plasma Damage on Low-k Dielectric Materials
2个月前
已完结
Non-damaging chemical photoresist strip process for copper/low-k interconnects
3个月前
已关闭
A Study of Dry Etching Characteristics of Polyimide Films in Flexible Displays with Trench Structures
5个月前
已关闭
Improved patterning quality of SU-8 microstructures by optimizing the exposure parameters
6个月前
已完结
Multistep profiles by mix and match of nanoimprint and UV lithography
6个月前
已关闭
Multilevel step and flash imprint lithography for direct patterning of dielectrics
6个月前
已完结
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