Lv11
10 积分 2024-09-19 加入
A Novel Junction Temperature Estimation Method Independent of Bond Wire Degradation for IGBT
36分钟前
待确认
Measurement of Thermal Resistance of SiC MOSFET Module Based on Conduction Voltage Drop
39分钟前
已完结
A review on real time physical measurement techniques and their attempt to predict wear-out status of IGBT
50分钟前
已完结
Comparative Analysis of IGBT Parameters Variation Under Different Accelerated Aging Tests
25天前
已完结
High Performance SiC Power Module Based on Repackaging of Discrete SiC Devices
25天前
已完结
Power Cycling Modeling and Lifetime Evaluation of SiC Power MOSFET Module Using a Modified Physical Lifetime Model
26天前
已完结
Life Prediction for Double-Sided Cooling Power Module Based on Fatigue–Creep Failure
26天前
已完结
The application of thermomechanically coupled phase-field models in electronic packaging interconnect structures
4个月前
已完结
A novel phase-field model for fatigue failure in functionally graded materials under thermo-mechanical loading
4个月前
已关闭
A phase-field model for thermo-elastic fracture in quasicrystals
4个月前
已关闭
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