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10 积分 2025-10-27 加入
Electrically Conductive Adhesives in Microelectronics Packaging
30天前
已完结
Performance of various fillers in adhesives applications: a review
1个月前
已完结
Air-sinterable copper pastes for next-generation electronics: a review
1个月前
已完结
Impact of trimodal copper powder mixing on copper-sintered joints for power semiconductor packaging
1个月前
已完结
High performance Cu sintering joint for power devices enabled by in-situ generation of Cu particles with multi-level hierarchical structures
1个月前
已完结
Fabrication of Nano Copper Highly Conductive and Flexible Printed Electronics by Direct Ink Writing
1个月前
已完结
The different self-assembled way of n- and t-dodecyl mercaptan on the surface of copper
3个月前
已完结
Reaction mechanism of stearic acid pyrolysis via reactive molecular dynamics simulation and TG-IR technology
3个月前
已完结
Influence of solvent polarity on dispersion, agglomeration, and sintering of nano/microscale copper powder systems
4个月前
已完结
High temperature reliability of pressureless sintered Cu joints for power SiC die attachment
5个月前
已完结
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