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60 积分 2025-10-27 加入
Pressureless Cu sintering via enhanced interfacial bonding: Effects of Au annealing processes
1个月前
已关闭
Superior sinterability of copper oxalate-coated Cu particles in a double reductant system and rapid compression sinter-bonding characteristics between Cu finishes
2个月前
已完结
Large area bare Cu-Cu interconnection using micro-Cu paste at different sintering temperatures and pressures
2个月前
已完结
Electrically Conductive Adhesives in Microelectronics Packaging
3个月前
已完结
Performance of various fillers in adhesives applications: a review
3个月前
已完结
Air-sinterable copper pastes for next-generation electronics: a review
3个月前
已完结
Impact of trimodal copper powder mixing on copper-sintered joints for power semiconductor packaging
3个月前
已完结
High performance Cu sintering joint for power devices enabled by in-situ generation of Cu particles with multi-level hierarchical structures
3个月前
已完结
Fabrication of Nano Copper Highly Conductive and Flexible Printed Electronics by Direct Ink Writing
4个月前
已完结
The different self-assembled way of n- and t-dodecyl mercaptan on the surface of copper
5个月前
已完结
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