Lv11
68 积分 2025-10-27 加入
A supersaturated Cu-Ag nanoalloy joint with ultrahigh shear strength and ultrafine nanoprecipitates for power electronic packaging
36分钟前
已完结
Low temperature and pressureless Cu-to-Cu direct bonding by green synthesized Cu nanoparticles
1个月前
已完结
Pressureless Cu sintering via enhanced interfacial bonding: Effects of Au annealing processes
1个月前
已完结
In-situ reduction enabled anti-oxidation sintering of copper paste in air for power module packaging
1个月前
已完结
High temperature reliability of pressureless sintered Cu joints for power SiC die attachment
1个月前
已完结
Pressureless Cu sintering via enhanced interfacial bonding: Effects of Au annealing processes
3个月前
已关闭
Superior sinterability of copper oxalate-coated Cu particles in a double reductant system and rapid compression sinter-bonding characteristics between Cu finishes
3个月前
已完结
Large area bare Cu-Cu interconnection using micro-Cu paste at different sintering temperatures and pressures
3个月前
已完结
Electrically Conductive Adhesives in Microelectronics Packaging
4个月前
已完结
Performance of various fillers in adhesives applications: a review
4个月前
已完结
皖公网安备34019202002308
