Lv41
654 积分 2025-01-08 加入
Intermetallic compound formation and growth behavior at the interface between indium and Au/Ni(V) metallization
8分钟前
已完结
Reliability analysis of SnAgCu lead-free solder thermal interface materials in microelectronics
13分钟前
已完结
Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding
2天前
已完结
Interfacial reaction and phase evolution in Ag and In solders for advanced low-temperature bonding technology
3天前
已完结
Electromigration reliability of low-temperature Bi-Sn micro joints with different surface coatings over Cu pads
3天前
求助中
Interfacial reaction and failure mechanism of Cu/Ni/SnAg1.8/Cu flip chip Cu pillar bump under thermoelectric stresses
3天前
已完结
Phase segregation, interfacial intermetallic growth and electromigration-induced failure in Cu/In–48Sn/Cu solder interconnects under current stressing
3天前
已完结
Suppressing interfacial voids in Cu/In/Cu microbump with Sn and Cu addition
3天前
已完结
Inhibiting the formation of interfacial voids in Cu/In/Cu microbump via Zn doping into Cu substrate
3天前
已完结
Enhancing mechanical strength of Cu/In/Cu microbump via Zn doped Cu substrate
3天前
已完结
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