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412 积分 2026-08-10 加入
Cross-Scale Reliability Simulation of Chiplet Devices Based on Sub-Modeling Approach
6天前
已完结
Data-driven acceleration of cross-scale thermo-mechanical fatigue assessment for chiplet packages
6天前
已完结
Cross-Scale Reliability Simulation of Chiplet Devices Based on Sub-Modeling Approach
6天前
已完结
Design guideline on board-level thermomechanical reliability of 2.5D package
11天前
已完结
Data-driven acceleration of cross-scale thermo-mechanical fatigue assessment for chiplet packages
16天前
已完结
Failure mechanisms and fatigue life optimization of solder joints in 2.5D packaging under thermal cycling: Experiments and cross-scale finite element submodeling
18天前
已完结
Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via finite element analysis and machine learning
18天前
已完结
Numerical simulation of reliability of 2.5D/3D package interconnect structure under temperature cyclic load
18天前
已完结
Fatigue lifetime prediction of power modules under power cycling using a volume-weighted averaging technique
18天前
已完结
Thermal-mechanical co-design and optimization of 2.5D chiplet integration
1个月前
已完结
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