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610 积分 2026-07-29 加入
Advanced TSV-BIST Repair Technique to Target the Yield and Test Challenges in 3-D Stacked IC’S
1个月前
已完结
Recent Advances and Trends in Advanced Packaging
1个月前
已完结
A 0.297-pJ/Bit 50.4-Gb/s/Wire Inverter-Based Short-Reach Simultaneous Bi-Directional Transceiver for Die-to-Die Interface in 5-nm CMOS
1个月前
已完结
TSV BIST Repair: Design-For-Test Challenges and Emerging Solution for 3D Stacked IC's
1个月前
已关闭
Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs
1个月前
已完结
From planar to stacked: a comparative analysis of 2D and 3D ICs from the perspective of architecture, performance, and fabrication
1个月前
已完结
Research progress of hybrid bonding technology for three-dimensional integration
1个月前
已完结
A Review on Hybrid Bonding Interconnection and Its Characterization
1个月前
已完结
3D Integrated Process and Hybrid Bonding of High Bandwidth Memory (HBM)
1个月前
已完结
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