Lv42
408 积分 2021-02-20 加入
Denuded Zone Formation by High Temperature Inert Anneal of 300 mm Cz-Silicon Wafers : AEPM: Advanced Equipment, Processes and Materials
1小时前
待确认
(Invited) Current Status and Trends in RF Silicon-on-Insulator Material and Device
1天前
已完结
Process Insights into 3D-DRAM with Vertical Bit Line and Scalable GAA Transistor
2个月前
已完结
Comparative Analysis for Two Alliances’ Sustainability of AI Chip Industry; SK Hynix-TSMC-NVIDIA vs. Intel-Naver-SEC
2个月前
已关闭
High Performance and Reliable 4F2 IGZO Vertical Channel Transistor (VCT) with Extremely Low Contact Resistance and 10 year BTI lifetime for sub-10nm DRAM
2个月前
已完结
4F2 DRAM Integration with Vertical Gate (VG) Cell Transistor and Peri-Under-Cell (PUC) Architecture
2个月前
已完结
White-Pixel Performance Improvement on CIS VIISta Trident Application
5个月前
已完结
Electrical breakdown in thin gate and tunneling oxides
5个月前
已完结
Degradation of dielectric breakdown field of thermal SiO2 films due to structural defects in Czochralski silicon substrates
5个月前
已完结
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