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274 积分 2025-12-04 加入
銅單晶與多晶濺鍍銅奈米孿晶薄膜及其低溫接合研究
25天前
已关闭
Atomic mechanisms of Cu–Cu low-temperature bonding dominated by plastic deformation
25天前
已完结
Atomic mechanisms of Cu–Cu low-temperature bonding dominated by plastic deformation
27天前
已完结
Analysis of Etch Profiles on C-Plane Wafers in Wet Etching of Sapphire Based on Undercutting Rate Distributions in Mixture of H 2 SO 4 and H 3 PO 4 at 236 °C
1个月前
已完结
Flexible radio-frequency carbon nanotube transistors operating at frequencies above 100 GHz
2个月前
已完结
Mechanically strengthened graphene-Cu composite with reduced thermal expansion towards interconnect applications
3个月前
已完结
Temperature-robust optical microphone with a compact grating interferometric module
7个月前
已完结
Synthesis of atomically thin sheets by the intercalation-based exfoliation of layered materials
8个月前
已完结
Intercalation in 2D materials and in situ studies
8个月前
已完结
Ions go in and new phases appear
8个月前
已完结
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