Lv4
588 积分 2023-10-02 加入
Approximating XGBoost with an interpretable decision tree
1个月前
已完结
Warpage analysis of multilayer thin film/substrate systems using the Eigenstrain method
1个月前
已完结
A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging
1个月前
已完结
Mechanism of the effect of esterified modified polystyrene-maleic anhydride on the dispersion and stability of carbon black in colour paste
1个月前
已完结
Maleic Anhydride and Its Derivatives: A Brief Review of Reactivity and Properties in Radical (Co)Polymerizations
1个月前
已关闭
Novel polyphenylene sulfide resin for high-frequency copper-clad laminates with low dielectric tangent and flame retardancy
1个月前
已完结
Preparation and Properties Investigation of Polyphenylene Oxide Modified Epoxy Resin Composites for High‐Frequency Copper Clad Laminates
1个月前
已完结
Volumetric nondestructive metrology for 3D semiconductor packaging: A review
1个月前
已完结
Density functional study of thermodynamic properties, thermal expansion and lattice thermal conductivity of Fe2VAl in the high-temperature region
1个月前
已完结
Synergistic Effects of Bio‐Based Benzoxazine/Epoxy Blends for Copper‐Clad Laminates With Low Dielectric Performance
1个月前
已完结
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