Lv11
68 积分 2021-07-03 加入
Multi-objective optimization of thermomechanical-electrical performance in through-silicon via based three-dimensional chip using non-dominated sorting genetic Algorithm-III
5小时前
已完结
Porosity and Young's modulus of pressure-less sintered silver nanoparticles
2个月前
已完结
The influence of porosity and pore shape on the thermal conductivity of silver sintered joint for die attach
2个月前
已完结
A Predictive Model for Thermal Conductivity of Nano-Ag Sintered Interconnect for a SiC Die
2个月前
已完结
Parasitics consideration of layout design within IGBT module
2个月前
已完结
Reliability assessment for a double-sided cooling power electronics module
2个月前
已完结
Unsymmetrical gate voltage drive for high power 1200V IGBT<sup>4</sup> modules based on coreless transformer technology driver
2个月前
已完结
Benefits of new CoolSiCTM MOSFET in HybridPACKTM Drive package for electrical drive train applications
2个月前
已完结
Analysis of Device and Circuit Parameters Variability in SiC MOSFETs-Based Multichip Power Module
4个月前
已完结
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