Lv11
40 积分 2021-07-03 加入
Simulation analysis of residual stress of BGA solder joints after reflow soldering based on element birth and death technology
7小时前
待确认
Thermomechanical Challenges of 2.5-D Packaging: A Review of Warpage and Interconnect Reliability
15天前
已完结
An Efficient Location-Connection-Decoupling Layout Design Method for Multi-Chip SiC Modules with Low Electrical and Thermal Impedance
1个月前
已完结
Multi-objective optimization of thermomechanical-electrical performance in through-silicon via based three-dimensional chip using non-dominated sorting genetic Algorithm-III
1个月前
已完结
Multi-objective optimization of thermomechanical-electrical performance in through-silicon via based three-dimensional chip using non-dominated sorting genetic Algorithm-III
2个月前
已完结
Porosity and Young's modulus of pressure-less sintered silver nanoparticles
4个月前
已完结
The influence of porosity and pore shape on the thermal conductivity of silver sintered joint for die attach
4个月前
已完结
A Predictive Model for Thermal Conductivity of Nano-Ag Sintered Interconnect for a SiC Die
4个月前
已完结
Parasitics consideration of layout design within IGBT module
4个月前
已完结
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