Lv4
640 积分 2021-07-03 加入
Nondestructive Warpage Measurements of LSI Chips in a Stacked SiP by using High-Energy X-ray Diffraction
10天前
已完结
Investigation on Package Warpage and Reliability of the large size 2.5D Molded Interposer on Substrate (MIoS) Package
15天前
已完结
Study on warpage of the AlSiC substrate in reflow soldering process of the IGBT module
1个月前
已完结
Rough contact surface reconstruction based on A mechanical-thermal contact model
1个月前
已完结
Derivation of analytical expressions for the stress and strain distributions, bending plane and curvature radius in multilayer thin-film composites
4个月前
已完结
Theoretical Model of Thermal Stress in the Film-Substrate System of Optical Thin Film
4个月前
已完结
Influence of fatigue on superconducting REBCO tapes under repeated cyclic tensile, bending and twisting loads: A simulation-based investigation
4个月前
已完结
Metal-Multilayered Nanomechanical Cantilever Sensor for Detection of Molecular Adsorption
4个月前
已完结
Interlaminar mechanical performance of a multi-layered photovoltaic-thermoelectric hybrid device
4个月前
已完结
Effect of Top-Coat Thickness and Interface Fluctuation on the Residual Stress in APS-TBCs
4个月前
已完结
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