Lv4
626 积分 2026-07-28 加入
5617 Development of Laser Drilling Machine for Printed Wiring Boards
6天前
已关闭
Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon
11天前
已完结
Through-package-via formation and metallization of glass interposers
11天前
已完结
Thermal Management of Heterogeneously Integrated HBM-GPU Module with Step Height Difference
19天前
已完结
Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching
1个月前
已完结
Femtosecond laser induced selective etching in fused silica: optimization of the inscription conditions with a high-repetition-rate laser source
1个月前
已完结
Process Integration and Reliability Challenges of Through-Glass Vias for Glass-Based Advanced Packaging: A Focused Review
1个月前
已完结
High-energy (>200 mJ), 1 kHz picosecond laser based on a directly liquid-cooled Yb:YAG thin-disk regenerative amplifier
1个月前
已完结
Ultrahigh-speed laser drilling of transparent materials through transient excitation
1个月前
已完结
Glass for 5G applications
1个月前
已完结
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