Lv21
130 积分 2025-08-27 加入
Performance improvement of yellow flip-chip mini-LEDs via full-angle distributed Bragg reflector
45分钟前
已完结
Low Resistance and Themarlly Stable Ohmic Contact on p-type GaN Using a RuO2 Diffusion Barrier
54分钟前
已关闭
Low-resistance and high-reflectance Ni∕Ag∕Ru∕Ni∕Au ohmic contact on p-type GaN
57分钟前
已完结
Low-resistant and high-transparent Ru/Ni ohmic contact on p-type GaN
59分钟前
已完结
Flip-chip solder bump fatigue life enhanced by polymer encapsulation
16天前
已完结
A Heterogeneously Integrated and Flexible Inorganic Micro-display on FlexTrate™ using Fan-Out Wafer-Level Packaging
16天前
已完结
Role of diffusion anisotropy in β-Sn in microstructural evolution of Sn-3.0Ag-0.5Cu flip chip bumps undergoing electromigration
16天前
已完结
Electroplating of Cu/Sn bumps with ultrafine pitch and high uniformity for micro-LED interconnection
16天前
已完结
Investigation of Mg and Si doping at different temperature for multi-color micro-LEDs with tunnel junctions (Conference Presentation)
2个月前
已关闭
Improved forward voltage and external quantum efficiency scaling in multi-active region III-nitride LEDs
2个月前
已完结
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