Lv21
194 积分 2021-03-30 加入
Morphological evolution of InGaN/GaN quantum-well heterostructures grown by metalorganic chemical vapor deposition
44分钟前
已完结
Reduction of efficiency droop in c-plane InGaN/GaN light-emitting diodes using a thick single quantum well with doped barriers
1小时前
已完结
Reduction of efficiency droop in c-plane InGaN/GaN light-emitting diodes using a thick single quantum well with doped barriers
4天前
已完结
Investigation of Production Quality and Reliability Risk of ELK Wafer WLCSP Package
18天前
已完结
LowK wafer dicing robustness considerations and laser grooving process selection
18天前
已完结
Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications
19天前
已完结
Novel IR Laser Cleaving for ultra-thin Layer Transfer and 3D Stacked Devices
19天前
已完结
IR Laser Release for 3D Stacked Devices: Effect of the Release Stack Structure on the Debonding Mechanism
20天前
已完结
IR Laser Debond From Silicon Carrier Wafers With Inorganic Thin Film Release Layers for High-Density 2.5D and 3D Integration
20天前
已完结
Novel IR Laser Release Temporary Bonding Solution for Advanced 3D Stacking and Layer Transfer
20天前
已完结
皖公网安备34019202002308
