Lv11
20 积分 2026-07-02 加入
Microstructure and mechanical evolution of sintered silver on Ni/Pd/Au and Ni/Au finished substrates
8小时前
已完结
Thermo-Mechanical Stability of Resin-Added Sintered Silver Joints Between Si Die and Ni-/Au-Electroplated Substrate
14天前
已完结
Physics of failure and high-temperature reliability on Ag sintered ENIG finished die-attachments at 175 °C for integration of in-wheel motor systems
14天前
已完结
Study of Interaction Between Reflow Solder Flux and Humidity in Relation to Failures in Electronics
1个月前
已完结
Bonding-Based Method to Prevent Contamination in Polymer Integration for Semiconductor Applications
1个月前
已完结
Cu-Contamination-Free Hybrid Bonding via MoS2 Passivation Layer
1个月前
已完结
Modified Ni/Pd/Au-finished DBA substrate for deformation-resistant Ag–Au joint during long-term thermal shock test
1个月前
已完结
Combining hierarchical surface roughness with fluorinated surface chemistry to preserve superhydrophobicity after organic contamination
1个月前
已完结
Robust shear strength of Cu–Au joint on Au surface-finished Cu disks by solid-state nanoporous Cu bonding
1个月前
已完结
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