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40 积分 2026-07-02 加入
Enhancing Hydrophilicity of Electroplated Ag Metallization by Ar/O2 Plasma Treatment to Promote Ag Sintering Reaction
1天前
已完结
Interfacial Characteristic and Bonding Mechanism of Ag Nanoparticles on ENIG Surface
1个月前
已完结
A novel mechanical degradation mechanism in Ag nanopaste/Au pad interface: Grain boundary diffusion-induced Kirkendall-like voids
2个月前
已完结
Microstructure and mechanical evolution of sintered silver on Ni/Pd/Au and Ni/Au finished substrates
2个月前
已完结
Thermo-Mechanical Stability of Resin-Added Sintered Silver Joints Between Si Die and Ni-/Au-Electroplated Substrate
2个月前
已完结
Physics of failure and high-temperature reliability on Ag sintered ENIG finished die-attachments at 175 °C for integration of in-wheel motor systems
2个月前
已完结
Study of Interaction Between Reflow Solder Flux and Humidity in Relation to Failures in Electronics
3个月前
已完结
Bonding-Based Method to Prevent Contamination in Polymer Integration for Semiconductor Applications
3个月前
已完结
Cu-Contamination-Free Hybrid Bonding via MoS2 Passivation Layer
3个月前
已完结
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