| 标题 |
Robust shear strength of Cu–Au joint on Au surface-finished Cu disks by solid-state nanoporous Cu bonding |
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| DOI | |
| 其它 |
期刊:Microelectronic Engineering 作者:Byung-Jae Park; M. Saito; J. Mizuno; H. Nishikawa 出版日期:2022-05-01 |
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(2025-6-4)