Lv6
2830 积分 2024-01-12 加入
Low-temperature and pressureless sinter joining of Cu with micron/submicron Ag particle paste in air
21小时前
已完结
Pressureless sinter-joining of micron-Ag flake pastes at 160 °C enabled by solvent and interface engineering
21小时前
已完结
Improvement in the Thermal Conductivity of Silver Epoxy Adhesive by Treating with Water Vapor
1天前
待确认
Silver Conductive Adhesives with Long Pot Life and Stable Electrical-Thermal Performance
1天前
已完结
Effect of anhydride curing agents, imidazoles, and silver particle sizes on the electrical resistivity and thermal conductivity in the silver adhesives of LED devices
1天前
已完结
Micro-nano cooperative diffusion in bayberry-like porous Ag microparticle pastes enabling 125 °C ultralow-temperature sintering
8天前
已完结
Low temperature pressureless sintering micron-Ag paste enabling high quality SiC device packaging
8天前
已完结
Large-Area Bonding by Sintering of a Resin-Free Nanosilver Paste at Ultralow Temperature of 180 °C
15天前
已完结
Surface treatment of micron silver flakes with coupling agents for high-performance electrically conductive adhesives
26天前
已完结
Optimizing the performance of low-temperature silver paste: Influence and mechanism of silane coupling agent KH560
28天前
已完结
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