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2850 积分 2024-01-12 加入
Capillary Pressure and Solvent–Organic Shell Interactions: A Composite Mechanism in Sintering of Silver Pastes
19天前
已完结
Low-temperature and pressureless sinter joining of Cu with micron/submicron Ag particle paste in air
1个月前
已完结
Pressureless sinter-joining of micron-Ag flake pastes at 160 °C enabled by solvent and interface engineering
1个月前
已完结
Improvement in the Thermal Conductivity of Silver Epoxy Adhesive by Treating with Water Vapor
1个月前
已完结
Silver Conductive Adhesives with Long Pot Life and Stable Electrical-Thermal Performance
1个月前
已完结
Effect of anhydride curing agents, imidazoles, and silver particle sizes on the electrical resistivity and thermal conductivity in the silver adhesives of LED devices
1个月前
已完结
Micro-nano cooperative diffusion in bayberry-like porous Ag microparticle pastes enabling 125 °C ultralow-temperature sintering
1个月前
已完结
Low temperature pressureless sintering micron-Ag paste enabling high quality SiC device packaging
1个月前
已完结
Large-Area Bonding by Sintering of a Resin-Free Nanosilver Paste at Ultralow Temperature of 180 °C
2个月前
已完结
Surface treatment of micron silver flakes with coupling agents for high-performance electrically conductive adhesives
2个月前
已完结
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