| 标题 |
Large-Area Bonding by Sintering of a Resin-Free Nanosilver Paste at Ultralow Temperature of 180 °C |
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| DOI | |
| 其它 |
期刊:IEEE Transactions on Components, Packaging and Manufacturing Technology 作者:Shi Chen; Yun-Hui Mei; Meiyu Wang; Xin Li; Guo-Quan Lu 出版日期:2022-04-01 |
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(2025-6-4)