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190 积分 2025-05-12 加入
Amplitude stability analysis and experimental investigation of an AC excitation signal for capacitive sensors
1个月前
已关闭
Analytical modeling of thermo-mechanical stress for bond wire of IGBT module
2个月前
已完结
Resonant fatigue test performance of battery pack connections using wire bonding
2个月前
已完结
Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
2个月前
已完结
Influence of top-side metal layers on the performance of gold, silver, and copper wire bonds on aluminum pads
2个月前
已完结
State-of-the-art of the bond wire failure mechanism and power cycling lifetime in power electronics
2个月前
已完结
Wire bonding failure characterization of an IGBT based power module through impedance analysis
2个月前
已完结
Observation of Microstructural Evolution of Aluminum Bonding Wires in Power Electronic Package
2个月前
已完结
Analytical modeling of thermo-mechanical stress for bond wire of IGBT module
2个月前
已完结
Advances in Copper Wire Bonding Technology: Material Optimization, Interfacial Strength Bonding Interface Reliability, and Corrosion Resistance
2个月前
已完结
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