Lv57
850 积分 2025-05-12 加入
Optimization and Analysis of Ultrasonic Wedge Bonding Parameters for Enhanced Bonding Performance in 21700 Cylindrical Lithium Battery Modules
13天前
已完结
Finite element modeling and analysis of ultrasonic bonding process of thick aluminum wires for power electronic packaging
13天前
已完结
Enhanced thermal design of microchannel heat sinks with oak-shaped pin fins using machine learning and evolutionary algorithms
1个月前
已完结
Multi-objective optimization of biomimetic channel geometry in ceramic substrates using response surface methodology
1个月前
已完结
Enhanced multi-objective genetic algorithm for optimized thermal management in mini heat sinks
1个月前
已完结
Effects of wire bonding pressure and solder material on the reliability of TO-247 packaged SiC MOSFET under power cycling
3个月前
已完结
Hybrid junction temperature prediction of IGBTs combining detailed electro-thermal modelling and deep learning regression
3个月前
已关闭
A review in thermal management for advanced chip packaging from chip to heat sink
5个月前
已完结
Thermal transient characterization of semiconductor devices with multiple heat sources—Fundamentals for a new thermal standard
5个月前
已完结
Considerations for SiC super junction MOSFET: On-resistance, gate structure, and oxide shield
5个月前
已完结
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