Lv3
270 积分 2025-05-12 加入
A review of thermal interface material fabrication method toward enhancing heat dissipation
2天前
已完结
Thermal management of chips by a device prototype using synergistic effects of 3-D heat-conductive network and electrocaloric refrigeration
3天前
已完结
Integrated manifold microchannels and near-junction cooling for enhanced thermal management in 3D heterogeneous packaging technology
3天前
已完结
Graph-Model-Based Generative Layout Optimization for Heterogeneous SiC Multichip Power Modules With Reduced and Balanced Parasitic Inductance
11天前
已完结
Performance analysis of Gallium-based liquid metal as thermal interface material for chip heat dissipation
12天前
已完结
A 2.5D Multichip SiC MOSFET Power Module With Low Parasitic Inductance and High Dynamic Current Sharing Performance
23天前
已完结
Influence of Paralleling Dies and Paralleling Half-Bridges on Transient Current Distribution in Multichip Power Modules
23天前
已完结
Parasitic Inductance Modeling and Reduction for a Wire Bonded Half Bridge SiC MOSFET Multichip Power Module
23天前
已完结
Optimization and Validation of Current Sharing in IGBT Modules with Multi-chips in Parallel
23天前
已完结
A Comprehensive Design Method for Multichip Double-Sided Cooling Power Module With Multidimensional Self-and Mutual Inductances
23天前
已完结
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