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Higher Order Thermal Impedance Extraction of GaN Power HEMTs by I–V Measurements
2天前
已完结
Influence of a PCB Layout Design on the Efficiency of Heat Dissipation and Mutual Thermal Couplings between Transistors
2天前
已完结
A Technique for the In-Situ Experimental Extraction of the Thermal Impedance of Power Devices
2天前
已完结
Investigations of an Influence of the Assembling Method of the Die to the Case on Thermal Parameters of IGBTs
2天前
已完结
Maximum, effective, and average thermal resistance for GaN-based HEMTs on SiC, Si and sapphire substrates
1个月前
已完结
Measuring specificities of thermal resistance of IGBT power modules
1个月前
已完结
Improvement of interfacial thermal resistance between TIMs and copper for better thermal management
1个月前
已完结
Strategies for optimizing interfacial thermal resistance of thermally conductive hexagonal boron nitride/polymer composites: A review
1个月前
已完结
Design and Test of a Low Junction-to-Case Thermal Resistance Packaging Method
1个月前
已完结
Thermal Contact Resistance Optimization of Press-Pack IGBT Device Based on Liquid Metal Thermal Interface Material
1个月前
已完结
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