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70 积分 2025-01-23 加入
Influence of crystal orientation and incident plane on n-type 4H-SiC wafer slicing by using picosecond laser
25天前
已完结
Laser slicing of 4H-SiC wafers based on picosecond laser-induced micro-explosion via multiphoton processes
25天前
已完结
Ultrasonic-assisted stripping of single-crystal SiC after laser modification
28天前
已完结
Laser double-layer slicing of SiC wafers by using axial dual-focus
1个月前
已完结
Internal modified structure of silicon carbide prepared by ultrafast laser for wafer slicing
1个月前
已完结
Integrated LCOS-SLM-Based Laser Slicing System for Aberration Correction in Silicon Carbide Substrate Manufacturing
2个月前
已完结
Crack control for efficient nanosecond-laser slicing of large-size 4H-SiC crystals
2个月前
已完结
Integrated LCOS-SLM-Based Laser Slicing System for Aberration Correction in Silicon Carbide Substrate Manufacturing
2个月前
已关闭
Experimental investigation on crack evolution and separation strength in 4H-SiC slicing by sub-nanosecond laser
2个月前
已完结
Polarization dependences of the laser in 4H-SiC wafer slicing
2个月前
已关闭
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