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50 积分 2025-01-23 加入
Damage-free lift-off of epitaxial HgCdTe thin films for future curved infrared imaging array applications
2个月前
已完结
3D-Printed Frequency-Diverse Metasurface for Camera-Based Terahertz Frequency Analyzer
2个月前
已完结
3D-Printed Frequency-Diverse Metasurface for Camera-Based Terahertz Frequency Analyzer
2个月前
已完结
Micromachined Double‐Membrane Mechanically Tunable Metamaterial for Thermal Infrared Filtering
2个月前
已完结
3D Holographic Volumetric Multi‐Foci Array for Two‐Photon Lithography
2个月前
已完结
Influence of crystal orientation and incident plane on n-type 4H-SiC wafer slicing by using picosecond laser
3个月前
已完结
Laser slicing of 4H-SiC wafers based on picosecond laser-induced micro-explosion via multiphoton processes
3个月前
已完结
Ultrasonic-assisted stripping of single-crystal SiC after laser modification
3个月前
已完结
Laser double-layer slicing of SiC wafers by using axial dual-focus
3个月前
已完结
Internal modified structure of silicon carbide prepared by ultrafast laser for wafer slicing
4个月前
已完结
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