Lv21
184 积分 2024-06-26 加入
电子胶黏剂行业领袖 Colin
Transfer molding for power semiconductor modules
3小时前
已完结
Ag particles for sinter bonding: Flakes or spheres?
1个月前
已完结
阳离子固化环氧固晶胶在LED小芯片封装中的应用
3个月前
已完结
4D Printing of Magnetoactive Soft Materials for On-Demand Magnetic Actuation Transformation
4个月前
已完结
Discovery of Copolymer Resins with Optimal Viscosity–Toughness–Heat Resistance Trade-Offs via the Material Genome Approach
5个月前
已完结
Design and Characterization of Topical Formulations: Correlations Between Instrumental and Sensorial Measurements
5个月前
已完结
The role of rheology in cosmetics research: a review
5个月前
已完结
Acclimatization Status of Temperate-zone Man
5个月前
已完结
Machine Learning-Assisted Design of Advanced Polymeric Materials
5个月前
已完结
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