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184 积分 2024-06-26 加入
电子胶黏剂行业领袖 Colin
The influence of monobutyl itaconate and β-carboxyethyl acrylate on acrylic latex pressure sensitive adhesives
2个月前
已完结
Highly reliable, low cost, isotropically conductive adhesives filled with Ag-coated Cu flakes for electronic packaging applications
3个月前
已完结
Cycloaliphatic epoxy resin cured with anhydride in the absence of catalyst
3个月前
已完结
Conductive Cu Paste as a via Filling Material for Through Glass via (TGV)
7个月前
已完结
Advanced Insulation Materials for Next Generation Packaging Technology
9个月前
已完结
Effect of anhydride curing agents, imidazoles, and silver particle sizes on the electrical resistivity and thermal conductivity in the silver adhesives of LED devices
10个月前
已完结
Transfer molding for power semiconductor modules
1年前
已完结
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