Lv2
182 积分 2024-06-26 加入
电子胶黏剂行业领袖 Colin
The Packaging Technology of CMOS Image Sensors: A Review
1个月前
已完结
The influence of monobutyl itaconate and β-carboxyethyl acrylate on acrylic latex pressure sensitive adhesives
4个月前
已完结
Highly reliable, low cost, isotropically conductive adhesives filled with Ag-coated Cu flakes for electronic packaging applications
5个月前
已完结
Cycloaliphatic epoxy resin cured with anhydride in the absence of catalyst
5个月前
已完结
Conductive Cu Paste as a via Filling Material for Through Glass via (TGV)
9个月前
已完结
Advanced Insulation Materials for Next Generation Packaging Technology
11个月前
已完结
Effect of anhydride curing agents, imidazoles, and silver particle sizes on the electrical resistivity and thermal conductivity in the silver adhesives of LED devices
1年前
已完结
Transfer molding for power semiconductor modules
1年前
已完结
皖公网安备34019202002308
