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708 积分 2026-05-15 加入
Broadband Characterization of Newly Developed ABF Type A Material for Advanced Packaging and mmWave Applications
6天前
已完结
Effective Build-Up Substrate Design for Warpage Reduction and Reliability Enhancement in Advanced Semiconductor Packages
7天前
已完结
Development of Glass Core Build-up Substrate with TGV
7天前
已完结
Simulation and Metrological Applications for RDL Patterning Development of Glass Substrate
7天前
已完结
The Study of Glass Core Substrates Warpage
7天前
已完结
Stress analysis of glass substrates vs. resin substrates in double-layer ABF sandwich structures
7天前
已完结
Hierarchical sandwich composite film with engineered interfaces for concurrent high-frequency ultra-low dielectric constant and high thermal conductivity
3个月前
已完结
Hybrid Adaptive Impedance and Admittance Control Based on the Sensorless Estimation of Interaction Joint Torque for Exoskeletons: A Case Study of an Upper Limb Rehabilitation Robot
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