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408 积分 2026-08-02 加入
0.021-μm 2 High-Density SRAM in Intel 18A RibbonFET Technology With PowerVia Backside Power Delivery
4天前
已完结
PMOS junction optimization for 3D NAND FLASH memory with CMOS under array
22天前
已完结
4F2 DRAM Integration with Vertical Gate (VG) Cell Transistor and Peri-Under-Cell (PUC) Architecture
1个月前
已完结
15.10 A Vertical-Cell-Transistor-Based 4F 2 DRAM with Cell-on-Peripheral Architecture Using Wafer-to-Wafer Hybrid Copper Bonding
1个月前
已完结
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