Lv11
16 积分 2025-01-16 加入
Deep learning-based detection of dislocation defects in 4H-SiC substrates via enhanced photoluminescence imaging
1小时前
待确认
Formation mechanism of surface quality in 4H-SiC wafers sliced via picosecond laser with gradient Energy-Modulation Multi-Pass modification process
1小时前
求助中
Crack propagation mechanisms in laser slicing of 4° off-axis 4H-SiC and separation strength regulation via multi-beam processing
1小时前
已完结
Stress and crack dynamics in nanosecond laser slicing of silicon carbide
18天前
已关闭
Improvement of the resistivity uniformity of 8-inch 4H–SiC wafers by optimizing the thermal field
1个月前
已完结
Impact of material anisotropy on ultrafast laser dicing of SiC wafers for enhancing efficiency and quality
1个月前
已完结
Characteristics and Behaviors Analysis of Etch Pits in 4H-SiC Epilayers by Molten KOH Etching
1个月前
已完结
Laser stealth dicing of β-Ga2O3: Theoretical and experimental studies
2个月前
已完结
Fine optimization of aberration compensation for stealth dicing
2个月前
已完结
Ultrasonic-assisted stripping of single-crystal SiC after laser modification
2个月前
已完结
皖公网安备34019202002308
