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300 积分 2026-03-06 加入
Development of a sensor-compatible vascular microphysiological system for metabolic monitoring during drug-induced endothelial injury
2个月前
已完结
Thermal Conductivity Enhancement of Copper Pillar Bumps via End-Face Nanostructuring for 3D IC Packaging
3个月前
已关闭
Enhanced Thermal Conduction of Copper Pillar Arrays via End-Face Microstructuring for Electronic Packaging
3个月前
已关闭
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