Lv21
128 积分 2026-01-06 加入
Relative importance of solder and wire bond defects on the maximum junction temperature of IGBT devices
1小时前
待确认
An in-situ multiresponsive flexible sensor utilizing electrochemical impedance spectroscopy for the precise and simultaneous detection of pressure, temperature, and humidity
5个月前
已完结
Temperature dependent structural, electrical and electronic investigation of VO2 (B) thin film
7个月前
已完结
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