Lv2
200 积分 2026-09-19 加入
Intramolecular heterostructured carbon nitride with heptazine-triazine for enhanced photocatalytic hydrogen evolution
10天前
已完结
Novel silicothermic reduction method to obtain Si3N4 ceramics with enhanced thermal conductivity and fracture toughness
12天前
已完结
Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics
12天前
已完结
Phase-change materials for thermal management
26天前
已完结
Materials for high-temperature digital electronics
28天前
已完结
Dependencies of Temperature Sensitive Electrical Parameters and Influence of Degradation in Silicon Carbide MOSFETs: A Review
29天前
已完结
Thermal Interface materials for efficient heat management in electronics
1个月前
已完结
A critical review of the preparation strategies of thermally conductive and electrically insulating polymeric materials and their applications in heat dissipation of electronic devices
1个月前
已完结
Neural network and Taguchi design optimization of solvent fraction effects on heat dissipation in Bodewadt flow
1个月前
已完结
Thermal conductive radiative cooling film for local heat dissipation
1个月前
已完结
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