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36 积分 2026-01-21 加入
Material Characterization and Warpage Modeling for Power Devices Active Metal Brazed Substrates
6天前
已完结
Effect of Process and Design Parameters in Cu/SiCN Hybrid Bonding Process: A Finite Element Analysis Study
8天前
已完结
Improvement of plating uniformity for copper patterns of IC substrate with multi-physics coupling simulation
8天前
已完结
Thermal cycling simulation and fatigue lifetime estimation of Si3N4-AMB substrates
16天前
已完结
Creep‐fatigue behavior of thin‐walled plate with holes: Stress state characterization and life estimation
17天前
已完结
Thermomechanical finite element modeling of Cu–SiO2 direct hybrid bonding with a dishing effect on Cu surfaces
17天前
已完结
Finite element analysis of the effect of TiC or graphite modified composite fillers on the thermal residual stress of AMB ceramic substrates
2个月前
已完结
Effect of high temperature cycling on both crack formation in ceramics and delamination of copper layers in silicon nitride active metal brazing substrates
2个月前
已完结
Enhanced Zinc Deposition and Dendrite Suppression in Aqueous Zinc‐Ion Batteries Via Citric Acid‐Aspartame Electrolyte Additives
2个月前
已完结
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