Lv5
1010 积分 2024-08-15 加入
Fabrication and transfer of fine pitch RDL using Si temporary carrier combined with IR laser release approach
1天前
已完结
IR Laser Debond From Silicon Carrier Wafers With Inorganic Thin Film Release Layers for High-Density 2.5D and 3D Integration
7个月前
已完结
Thermal Modeling of IR Laser Debond with Inorganic Thin Film Release Layers
7个月前
已完结
Controlled interfacial debonding based on laser induced deformation-impact coupling effect for advanced packaging
7个月前
已完结
Laser debonding application in ultra-thin device processing
7个月前
已完结
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