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1540 积分 2024-08-07 加入
C4F6 Etching Characteristics for High‐Aspect‐Ratio Etching of SiO2 Films Using an Inductively Coupled Plasma Etching System With Low‐Frequency Bias Power
4个月前
已完结
Plasma simulation of HF plasma generated in dual-frequency chamber for high aspect ratio dielectric etching
4个月前
已完结
Future of plasma etching for microelectronics: Challenges and opportunities
4个月前
已完结
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